Effects of infrared radiation on the mechanical properties of an epoxy-amine adhesive using a Central Composite Design method

Recently, the aerospace industry has been facing many challenges, including an increase in production rates to meet market needs. In context of adhesives and liquid shim applications, this means possibility on-demand curing. other words, must cure slowly at room temperature process be accelerated any time allow for fastest polymerization possible. However, while curing is possible several ways (ultraviolet radiation, induction, or microwave), route chosen study infrared (IR) radiation. This because method allows low temperatures (i.e., around 50°C) universal, hence requiring no modification adhesive formulation. Given that acceleration using thermal (temperature) nonthermal (radiation–matter interaction) effects demonstrated another study, it now important properties such after under IR we measured following properties: adherence on aluminum 2024-T3 via three-point bending, tensile strength modulus, flexural modulus. We also studied parameters lamp, lamp–adhesive distance rate polymerization. For purpose, a composite design experiments was used, which generally two main advantages: screening response surface methodology. On one hand, determining factors, among those selected, have significant influence responses. At same time, interactions (synergistic effects) between influencing parameters. methodology quantifying optimal ones.